Qualcomm Snapdragon 450 14nm FinFet chipset announced

Qualcomm has announced its latest entry level chipset, the Snapdragon 450 Mobile Platform, at the MWC 2017 Shanghai tech show. The new SoC is built using the 14nm FinFET Process, and improves upon its predecessor, the Snapdragon 435, by offering 25% better computing and graphical performance.

Qualcomm Snapdragon 450

That is thanks to the eight ARM Cortex A53 Cores (octa-core) in the Qualcomm Snapdragon 450, and the Qualcomm Adreno 506 GPU which the chipset uses for the graphics. The SoC supports Qualcomm Quick Charge 3.0, which can charge a phone from zero to 80 percent in about 35 minutes. It is also power efficient in that, it offers 30% reduction in power usage while gaming.

The Snapdragon 450 supports enhanced dual cameras 13mp + 13mp or one 21mp camera, and includes real-time Bokeh effect, hybrid autofocus, 1090p video recording and playback @60 fps. The chipset supports Full HD 1080p displays, and Qualcomm Hexagon DSP for multimedia, camera and sensor processing. Connectivity wise, the Snapdragon 450 has an X9 LTE Modem which supports 2 x 20MHz CA (Carrier Aggregation) for downloads (up to 300Mbps) and downloads (up to 150Mps), Wi-Fi 802.11ac with MU-MIMO, and USB 3.0.

Devices powered by the Qualcomm Snapdragon 450 are expected to be available by the end of 2017.



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