Phone chipset manufacturer, MediaTek, has officially announced the new generation of its flagship processors, in the Helio X20 series. The new chips are the Helio X23 and the Helio X27.
To be honest, they are not much of an upgrade over the existing upgrade over the current gen flagship SoC's from the company, the X20 and X25. The company says the new SoCs are 20% better over their predecessors, when it comes to performance . The only real changes are slightly overclocked CPUs and GPUs, and MediaTek's high end chipsets are still using the outdated 20nm Process. Here is a more in depth look at the details.
Both the MediaTek Helio X23 and the Helio X27, use a Tri-Cluster Deca-Core architecture, which means it has ten cores in the processor, divided in three sets of cores. The X23's CPU has 2 ARM Cortex A72 cores clocked @ 2.3GHz, 4 A53 cores @1.85GHz and 4 more Cortex-A53 cores @1.4GHz. It has an ARM Mali T880 MP4 GPU clocked @ 780MHz.
The X27 on the other hand, has 2 A72 cores topped @ 2.6GHz, 4 A53 cores @2.0GHz and 4 A53 cores @1.6GHz, also with an ARM Mali T880 MP4 GPU slighlty overcloded @875 MHz.
Both chipsets support up to 4GB of LPDDR3 RAM (so there is no support for LPDDR4). The chipsets support Full HD 1080p displays @120 fps, and Quad HD displays @60fps. The chipsets come with a new display techonolgy called, MiraVision EnergySmart Screen, which reduces power consumption based on the screen content and ambient lighting.
The X23 and X27 chipsets support dual camera configurations, using the MediaTek Imagiq ISP (image signal processor) which uses a single ISP for integrating monochrome and RGB cameras, DoF (Depth of field), Dual PDAF (Phase detection Auto focus), for better clarity and better quality photos. The X23 and X27 chipsets support Category 6 LTE with 20 + 20 Carrier Aggregation, and up to 300 Mbps max download speeds, and up to 150 Mbps upload speeds. The Wi-Fi connectivity on the boards support 80.11ac @ up to 280MBps downloads.
MediaTeK Helio X23 Technical Specifications:
- Process: 20nm
- CPU: 2x A72 @2.3GHz + 4x Cortex-A53 @1.85GHz + 4x Cortex-A53 @1.4GHz
- Memory: up to 4GB LPDDR3 RAM
- GPU: ARM Mali T880 MP4 @ 780MHz
- Display: WQXGA (Quad HD) 2560x1600 60fps, Full HD 1920x1080 120fps, MiraVision EnergySmart Screen
- Modem: Cat-6 LTE with 20+20 CA, 300Mbps uploads and 50Mbps downloads
- Connectivity: Wi-Fi 802.11ac up to 280Mbps, GPS, Glonass, Beidou, Blueooth, FM Radio
MediaTeK Helio X27 Technical Specifications:
- Process: 20nm
- CPU: 2x A72 @2.6GHz + 4x A53 @2.0GHz + 4x-A53 @1.6GHz
- Memory: up to 4GB LPDDR3 RAM
- GPU: ARM Mali T880 MP4 @ 875MHz
- Display: WQXGA (Quad HD) 2560x1600 60fps, Full HD 1920x1080 120fps, MiraVision EnergySmart Screen
- Modem: Cat-6 LTE with 20+20 CA, 300Mbps uploads and 50Mbps downloads
- Connectivity: Wi-Fi 802.11ac up to 280Mbps, GPS, Glonass, Beidou, Blueooth, FM Radio
MediaTek says that phones powered by the new Helio X23 and Helio X27 SoCs will be available soon.